High Density PCB

High-density boards push trace and pad pitch beyond standard HDI without going full any-layer — the sweet spot for camera modules, IoT sensor boards and dense FPGA breakouts. 22 SKUs at 75 µm line/space and 100 µm via pitch, with mSAP and SAP fabrication options for the most aggressive geometries. Designers pick this category when they need denser routing than standard multi-layer can deliver but don't need the full HDI premium. FQC qualifies these against IPC-6012 Class 3A.