2-Stage HDI PCB

A 2-stage HDI high-density PCB supporting up to 16 layers, built by sequential lamination with stacked microvias formed by laser, mechanical drilling, or photo-imaging. 2-stage HDI means the board is laminated, drilled, and plated twice, allowing microvias to span any pair of layers within the build-up region — far more routing flexibility than a single-stage HDI design. The construction is built around the high-density interconnect logic: dense traces between fine-pitch BGA pads, stacked vias under the pad, and high pin counts in compact footprints. Used in mobile devices and wearables where space is the binding constraint, automotive ECUs and ADAS controllers, medical imaging and life-support modules, industrial robots and motion controllers, and LED lighting drivers with embedded wireless.