Wafer Test Probe Card PCB

A 34-layer wafer-test probe card PCB on Isola 370HR, 4.75±0.254mm thick, with 0.175mm blind-hole diameter, 0.10mm laser microvias, 0.30mm minimum mechanical drill, and a 15.83:1 board-to-hole aspect ratio. Wafer probe cards sit between the ATE tester and the silicon wafer; the board has to fan out thousands of test channels from a fine-pitch probe array to the tester interface, hold tight impedance for high-speed scan and functional patterns, and survive thousands of touchdowns without warpage. The high layer count handles channel density; 370HR provides high Tg and CAF resistance for the punishing thermal cycling of test floors. Sihui Fuji controls press shrinkage, drill accuracy, and hole copper thickness across all 34 layers. Used in semiconductor wafer test for microprocessors, memory, FPGAs, and AI accelerator silicon.