8-Layer Impedance Controlled PCB

An 8-layer high-density PCB with controlled impedance on S1000H mid-loss laminate, 1.6±0.127mm thick, finished with OSP for fine-pitch SMT assembly. The eight-layer stack alternates signal and reference planes to give every high-speed trace a clean return path, which is what makes consistent characteristic impedance achievable. Designed for high-speed data transmission, networking, and telecom equipment — applications where signal-impedance variation directly causes bit errors and EMI. The OSP finish keeps copper pads flat for fine-pitch QFP, BGA, and CSP devices, and pairs well with reflow profiles tuned for lead-free solder. Used in computer motherboards, datacenter and AI server line cards, telecom infrastructure, medical imaging electronics, and industrial process-control systems.