
A high-density PCB built for LED lighting modules, using high-density wiring and microvia construction with low-Dk, low-attenuation dielectric to reduce signal-quality loss as electronics shrink and gain functions. Modern LED drivers integrate constant-current control, dimming, color tuning, and wireless control onto a single board, which forces tighter component spacing, faster signal transmission, more wiring per layer, and shorter point-to-point trace lengths. HDI construction with sequential lamination and microvias delivers the routing density needed for BGA, CSP, and DCA assembly methods that have become standard in driver IC packages. Used in commercial LED fixtures, smart-home lighting, automotive headlight and taillight control, architectural lighting, and industrial high-bay LED systems.
Specs
| Characteristic | High-density wiring with microvia, low-Dk dielectric |
Applications