
A 6-layer hybrid PCB for EV traction inverters, built on S1000-2M laminate with embedded copper blocks at 1.8±0.18mm thickness and ENIG finish. The embedded copper blocks sit directly under the SiC or IGBT power switches and conduct heat into the chassis, eliminating wire-bonded power modules in many designs. The 6-layer stack separates gate-drive, current-sense, and isolated control routing from the power plane, which keeps switching dv/dt noise from corrupting feedback loops. ENIG finish accommodates both fine-pitch isolated gate drivers and large power-stage footprints on the same board. Typical use in EV traction inverters, on-board chargers, DC fast-charging modules, hybrid powertrain controllers, industrial servo drives, and renewable energy converters where compact thermal management and low control-loop noise are co-equal design priorities.
Specs
| Layers | 6 |
| Material | S1000-2M + copper block |
| Board Thickness | 1.8±0.18mm |
| Surface Finish | ENIG |
Applications