
A double-sided aluminum-core PCB on ST115GB dielectric, 1.6±0.16mm thick with ENIG finish and 1oz copper. Designed for telecom power amplifiers, base-station rectifiers, and outdoor RF heads where the heatsink chassis doubles as thermal mass. ENIG provides reliable bonding of aluminum wire bonds and BGA reflow over the operating temperature range.
Specs
| Layers | 2 |
| Material | ST115GB + aluminum core |
| Board Thickness | 1.6±0.16mm |
| Surface Finish | ENIG |
| Copper Weight | 1oz |
Applications