PRODUCT SPEC
Embedded Copper Block PCB
A multilayer embedded copper block PCB for high heat flux and high-current assemblies. The structure embeds copper blocks from one side inside a multilayer HDI board, improving thermal dissipation, saving board area, strengthening the structure, improving reliability, and supporting signal-integrity optimization. Capabilities include 2-30 layers, 0.8-3.0 mm copper block thickness, 3-400 mm copper block size, 3/3 mil inner routing, 3.5/3.5 mil outer routing, 0.10 mm laser vias, and 16:1 through-hole aspect ratio.
Specs
| Structure | Multilayer embedded copper block, single-side embedding, HDI structure |
| Layers | 2-30 |
| Copper Block Thickness | 0.8-3.0 mm |
| Copper Block Size | 3-400 mm |
| Line / Space | 3/3 mil inner, 3.5/3.5 mil outer |
| Min Hole Size | 0.10 mm laser / 0.15 mm mechanical |
| Min Annular Ring | 4 mil |
| Hole-to-Conductor Spacing | 5 mil up to 6L, 6 mil for 7-11L, 8 mil for 12L+ |
| Aspect Ratio | 1:1 blind vias; 16:1 through holes |
| Dimensional Tolerance | +/-0.10 mm, special +/-0.05 mm |
| Surface Finish | ENIG, ENEPIG, Flash Gold, Hard Gold, OSP |
Applications
Power ElectronicsEVAutomotiveEnergyIndustrial Control
