
A double-sided copper-base PCB on ST115GB dielectric, 1.6±0.16mm thick with ENIG finish and 2oz copper. Laser-drilled blind vias contact the copper base directly under heat-generating devices, doubling thermal-via efficiency versus a standard MCPCB. Targets EV traction inverters, on-board chargers, telecom power amplifiers, and high-current DC/DC converters where sub-1°C/W junction-to-case is required.
Specs
| Layers | 2 |
| Material | ST115GB + copper substrate |
| Board Thickness | 1.6±0.16mm |
| Surface Finish | ENIG |
| Copper Weight | 2oz |
| Vias | blind via to copper base |
Applications