Six-Stage Laser-Drilled HDI PCB

A 14-layer HDI PCB manufactured with a six-stage laser drilling sequence, on Elite EM-370(Z) high-Tg laminate, 1.6±0.16mm thick with ENIG finish. Six lamination cycles stack laser-drilled blind via spans through the layer count, giving designers six independent depths of microvia interconnect. This unlocks aggressive routing under fine-pitch BGAs and shortens high-speed signal paths far below what mechanical drilling can achieve, with smaller via diameters, tighter pads and lower stub effects. EM-370(Z) provides Tg around 180°C, low CTE in the Z-axis, and good thermal cycling reliability for boards that see lead-free reflow plus operating thermal swing. Suited to mobile devices, computers, digital cameras, AI server modules, switch line cards and 5G radio boards where signal density is the binding constraint.