20-Layer Any-Layer HDI PCB

A 20-layer any-layer HDI PCB built for very high interconnect density with a simplified routing structure. The stackup supports 9 lamination cycles, 0.075 mm laser-drilled microvias, +/-0.05 mm interlayer registration, +/-0.05 mm outline accuracy, and ENIG surface finish. The any-layer interconnect structure reduces routing complexity, shortens production cycles, improves yield, and helps maintain stable high-frequency performance while controlling material waste.