Multi-Stage Buried Hole HDI PCB

A 16-layer multi-stage buried hole HDI PCB on Isola 370HR high-Tg laminate, 2.0±0.2mm thick with ENIG surface finish. Buried vias connect specified inner layers without breaking out to either external surface, freeing both top and bottom for dense component placement. Multi-stage means the buried via structure is built across several lamination cycles, which dramatically expands routing options for designers working under tight pitch and high pin-count BGAs. The 370HR core provides Tg around 180°C and good CAF resistance, suiting boards that go through lead-free reflow several times during assembly. Suited to base-station equipment, server backplanes, AI accelerator boards, industrial controllers and aerospace avionics where wiring density and signal integrity drive the design.