8-Layer Blind Hole HDI PCB

An 8-layer blind hole HDI PCB built on S1000-2M FR-4 laminate, 1.6±0.16mm thick with ENIG surface finish. Blind vias terminate inside the stackup instead of cutting through the full board, freeing up routing channels and letting designers push trace and pad pitch further than a conventional through-hole 8-layer can support. The result is higher wiring density, shorter signal paths, and tighter component placement in the same footprint. Manufacturing combines laser drilling, sequential lamination, and electroplated via fill, so dimensional control on every blind layer is critical to yield. Typical end products are smartphones, tablets, laptops and other consumer electronics where space is constrained, plus medical instruments, telecom modules and aerospace electronics that need both density and reliability.