Multi-Stage Blind Hole HDI PCB

A 12-layer multi-stage blind hole HDI PCB on Panasonic R-5755G high-Tg laminate, 3.2±0.32mm thick with ENIG finish. Blind vias connect an outer layer to one or more inner layers without going through the entire board, and a multi-stage build stacks several blind via spans across separate lamination cycles. The result is much finer trace and pad pitch than a conventional through-hole 12-layer can support, plus better impedance control on critical high-speed nets. The 3.2mm thickness handles heavy power planes and rugged mechanical loads, while ENIG keeps fine-pitch SMT pads flat and solderable. Targeted at telecom backplane modules, industrial servers, datacenter accelerator cards, automotive ECUs and any high-density board where space and signal integrity drive the layout.