Resin-Plugged Via Board

A 10-layer PCB on S1000-2M FR-4 laminate, 1.6±0.16mm thick with ENIG finish, featuring resin-plugged via-in-pad processing. Through-vias in the BGA pad area are filled with non-conductive resin, planarized, and then copper-capped, eliminating solder wicking on assembly and yielding a flat surface for fine-pitch ball attach. Common in 5G baseband, AI accelerator cards, and high-density consumer modules.