
A 10-layer any-layer laser-drilled HDI PCB designed for electronic test instruments, on Elite EM-370(5) high-Tg laminate at 1.05±0.105mm thickness with ENIG finish. Any-layer laser drilling places microvias on every layer pair, enabling tight pin-escape under the fine-pitch FPGAs, ADCs and multiplexer chips that drive modern bench testers. The board hosts the main processor, power supply rails, display interface, signal-conditioning resistors and capacitors, and the communication interfaces that link the instrument to a PC or LAN. EM-370(5) glass-fiber reinforced epoxy delivers stable circuit performance and reliability across the wide power, current and frequency ranges typical of electronic test gear. Used in handheld multimeters and oscilloscopes, bench source-measure units, network analyzers, automated test fixtures and engineering lab instruments.
Specs
| Layers | 10 |
| Material | EM-370(5) |
| Board Thickness | 1.05±0.105mm |
| Surface Finish | ENIG |
Applications