PRODUCT SPEC
OSFP800 800G Optical Module PCB
A 10-layer any-layer HDI PCB for OSFP800 800G optical modules. The design uses M7-class high-frequency, high-speed material, 3/3 mil dense routing, ENEPIG surface finish, segmented gold fingers, and DIE/Wire bonding support. Key controls include 1.0 +/-0.1 mm board thickness, 0.10 mm laser vias, 0.15 mm mechanical drilling, 3 mil annular rings, 100 ohm +/-7 ohm impedance, Low-Dk Taiyo PSR-4000 D10ME solder mask, and tight outline accuracy down to +/-0.05 mm for special requirements.
Specs
| Structure | Any-layer HDI structure |
| Layers | 10-layer any-layer HDI |
| Material Grade | M7-class high-frequency/high-speed material |
| Board Thickness | 1.0 +/-0.1 mm |
| Line / Space | 3/3 mil inner and outer layers |
| Min Hole Size | 0.10 mm laser / 0.15 mm mechanical |
| Min Annular Ring | 3 mil |
| Impedance | 100 ohm +/-7 ohm |
| Aspect Ratio | 1:0.75 blind vias |
| Dimensional Tolerance | +/-0.08 mm, special +/-0.05 mm |
| Solder Mask | Low-Dk Taiyo PSR-4000 D10ME |
| Surface Finish | ENEPIG |
Applications
Optical ModuleTelecomDatacenterAI Server5G
