Any-Layer HDI Board

A 10-layer any-layer HDI PCB on IT-180A high-Tg laminate, 1.0±0.10mm thick with ENIG finish. Every layer pair carries a stacked, copper-filled laser microvia, allowing the designer to drop a via at any net on any layer without through-holes. The result is the highest routing density a non-package substrate can deliver. Used in flagship smartphones, smartwatches, AR/VR headsets, and densest 5G/AI modules.