8L HDI Board

An 8-layer HDI PCB on S1000-2M FR-4 laminate, 1.0±0.10mm thick with ENIG finish and 3/3 mil minimum line/space. One stage of laser-drilled microvia plus through-vias provides a balanced cost/density point for thin handheld and wearable assemblies. Common end use: smartphones, smartwatches, IoT modules, and small radio cards.