8-Layer PCB with Laser Drilling

An 8-layer HDI PCB with laser-drilled microvias on S1000-2M FR-4 laminate, 1.6±0.16mm thick with ENIG finish. CO2 and UV laser drilling produces blind vias as small as 4mil, replacing mechanical drilling on the upper layer pairs and freeing routing channels for tighter BGA escape. The board is suitable for smartphones, IoT modules, 5G small-cell radios and small medical instruments where space and signal density both matter.