4-Stage Laser Via HDI Board

A 12-layer HDI PCB with four-stage stacked laser microvias on Elite EM-370(Z) high-speed laminate, 1.6±0.16mm thick with ENIG finish. Four lamination cycles allow blind via spans on four outer layer pairs, enabling extreme routing density under 0.4mm-pitch BGAs and high-lane-count SerDes packages. Targets 5G/optical line cards, AI accelerator modules, and high-end network switches.