3-Stage Laser Via HDI Board

A 10-layer HDI PCB with three-stage stacked laser microvias on IT-180A high-Tg laminate, 1.6±0.16mm thick with ENIG finish. Three sequential lamination/drill/plate cycles produce blind via spans on three outer layer pairs, allowing direct interconnect between the surface and inner power planes without through-holes in the BGA escape area. Used in flagship handsets, dense optical modules, and edge-AI compute boards.