
A 16-layer HDI PCB on Elite EM-370(Z) high-speed laminate (Tg 170°C), 1.6±0.16mm thick with ENIG finish. Multi-stage laser via stackup combined with deep through-vias supports fine-pitch BGAs, multi-lane SerDes, and high power-plane count. Targets 5G transport, AI/HPC compute boards, datacenter switches, and high-end industrial controllers.
Specs
| Layers | 16 |
| Material | EM-370(Z) |
| Board Thickness | 1.6±0.16mm |
| Surface Finish | ENIG |
| Min Hole Size | 4mil (laser via) |
| Tg | 170°C |
Applications