14-Layer PCB with Laser Drilling

A 14-layer HDI PCB with laser-drilled microvias on Elite EM-370(Z) high-speed laminate, 1.6±0.16mm thick with ENIG finish. Multi-stage laser via stackup supports fine-pitch BGAs above 0.5mm and 25-56G SerDes routing without resorting to backdrill. Suited to 5G/optical transport line cards, AI-server CPU/GPU breakout boards, and dense consumer-electronics SoMs.