12-Layer Blind Hole PCB with Laser Drilling

A 12-layer HDI PCB with laser-drilled blind vias on IT-180A high-Tg laminate (Tg 180°C), 1.6±0.16mm thick with ENIG finish. Sequential lamination produces blind via spans on the outer pairs and through-vias only in the core, balancing routing density against board cost. Targets 5G transport equipment, AI-server NIC and accelerator cards, and high-end industrial controllers.