10L HDI Board

A 10-layer HDI PCB on S1000-2M FR-4 laminate, 1.2±0.12mm thick with ENIG finish and 3/3 mil minimum line/space. Two stages of laser microvia provide blind interconnect on the outer layer pairs, enabling 0.5mm-pitch BGA escape and dense routing. Common end use: 5G CPE, AI edge boards, networking modules, and dense consumer electronics.