10-Layer PCB with Laser Drilling

A 10-layer HDI PCB with laser-drilled microvias on S1000-2M FR-4 laminate, 1.6±0.16mm thick with ENIG finish. Two stages of laser via produce blind interconnect on layers 1-2 and 2-3, supporting fine-pitch BGAs and high-speed parallel buses. Typical applications include 5G base-station baseband, edge-AI servers, and high-density consumer electronics.