80-Layer ATE Tester PCB

An 80-layer high-multilayer test PCB built for Automatic Test Equipment (ATE), on Shengyi S1000-2M FR-4 with 6.35mm board thickness and electrolytic gold plating on the contact pads. The 6.35mm thickness handles the heavy mechanical load of pogo-pin towers and probe heads, while electrolytic gold provides hard, wear-resistant contact surfaces that survive repeated test insertions. Eighty functional layers route thousands of high-speed signal lines plus dedicated power, ground and decoupling planes, supporting parallel test of multiple devices per insertion. Sequential lamination and tight registration are required to keep impedance and crosstalk inside spec across all layers. Used to test memory chips, SoCs, AI accelerators and other complex ICs in semiconductor back-end manufacturing.