100-Layer ATE Tester PCB

A 100-layer ultra-high-layer-count test PCB engineered for Automatic Test Equipment (ATE) used in semiconductor packaging and final test. With 100 functional layers and a complex interconnect structure, the board carries thousands of pogo-pin signal channels, dedicated power and ground planes, and decoupling networks needed to exercise high-end ICs at full speed. Signal integrity, interlayer impedance control and mechanical flatness are tightly held so that test signals reach the device under test without distortion across many thousand insertion cycles. Stackup, materials and electrical performance are customized per program, since each ATE platform and each device type drives a different routing topology. Used to test high-end SoCs, memory devices, AI accelerators, networking ASICs and other advanced silicon during volume production.