
A 48-layer high-multilayer PCB at 6.35mm board thickness, with minimum drilled hole size of 0.25mm. With 48 functional layers, the board supports complex signal routing across multiple high-speed bus domains, dedicated power and ground planes, and embedded reference planes for tightly controlled impedance. The 6.35mm thickness gives the mechanical strength needed for backplane and tester-class boards while still allowing 0.25mm drilled vias for inter-layer connection. Manufacturing involves sequential lamination, careful registration between layers and controlled etching to keep impedance, crosstalk and reliability inside spec. Used in telecom backplanes, switch and router fabric cards, datacenter compute and storage backplanes, AI server boards, semiconductor test fixtures and other high-end applications where layer count is the constraint.
Specs
| Layers | 48 |
| Board Thickness | 6.35mm |
| Min Hole Size | 0.25mm |
Applications