24-Layer Multilayer PCB

A 24-layer multilayer PCB built up from copper and dielectric pairs laminated and electrically connected layer-to-layer. With 24 functional layers, the design separates power, ground and signal planes cleanly, gives each high-speed bus its own controlled-impedance reference, and routes far higher signal density than a single or double-sided board can support. Signals can be moved between layers to optimize length matching, reduce crosstalk and shorten critical paths. The board suits equipment that has outgrown the routing capacity of lower layer counts but does not need full HDI laser-via construction. Targeted at telecom equipment, datacenter line cards, AI server boards, industrial controllers, aerospace and military electronics, and any platform where pin count, signal density or power-plane structure forces a high layer count.