When producing PCB, there is often a problem of pressing bubbles. These bubbles can cause the quality of the pcb to not meet the requirements, affecting the reliability and stability of the product. Reason 1.Improper suppression can cause air, moisture, and pollutants to enter. 2.During the lamination process, due to insufficient heat, short cycles, poor quality of the prepreg, and incorrect pressing function, the degree of curing may be problematic. 3. The inner layer or prepreg is contaminated. 4. Insufficient glue. 5. Excessive glue flow - almost all the Almost all contained in the prepreg is extruded from the board. 6. In the case of non functional requirements, the appearance of large copper surfaces on the inner layer board should be minimized as much as possible. 7. When using vacuum compression, the pressure is insufficient, which damages the flow and adhesion of the adhesive. Solution 1. Bake the inner board to keep it dry before pressing it in. 2. Confirm the TG value of the multi-layer board. 3. Strengthen the cleaning management of work areas and storage areas. 4. Adjust the pressure of the press. 5. Strengthen inspection of the surface of the board. In addition, we should check whether the material of the plywood meets the requirements. The material of the plywood should be of high quality, which can ensure that there are no bubbles generated during the pressing process. If there are problems with the plywood materials, they should be promptly replaced with high-quality and suitable plywood materials for production requirements. Check whether the environment during the production process meets the requirements. During the production process, factors such as temperature, humidity, and pressure can all have an impact on the pressing process of PCB. Therefore, we should ensure that the production environment is stable and meets the requirements. If necessary, dehumidification equipment can be added or the temperature and humidity of the studio can be maintained. We should monitor the entire production process in a timely manner and promptly address any issues that arise. If bubbles are found to form, they should be adjusted and controlled at any time during the production process to ensure the production of high-quality products. It is not difficult to solve the problem of compressed air bubbles on boards. As long as attention is paid to inspecting the environment, using high-quality materials, adopting technical means, and timely monitoring measures, the quality of PCB can be guaranteed to be unaffected, and high-quality and reliable products can be produced.
