Transmitter Module Board

A 4-layer high-Tg transmitter PCB on HL832NS (Tg 230°C), 0.3±0.1mm thick with any-layer laser drilling, edge plating, and ENIG finish. The thin core and any-layer HDI construction let the board carry RF, analog, and digital traces in a footprint small enough for handheld and module-grade products. HL832NS holds dielectric properties under sustained temperature, which matters for transmitter front-ends where the PA dissipates significant heat. Edge plating shields the module and tightens the ground reference. Used in broadcast and TV transmitters, mobile and SATCOM radios, RFID and IoT transmitter modules, navigation beacons, and military radio modules where the transmitter, antenna, and control electronics must coexist on one small board.