Edge Copper Plating PCB

A 4-layer edge-plated PCB built on S1000H high-frequency laminate, 1.6±0.16mm thick with ENIG finish. The board edges are wrapped in plated copper to form a continuous shield, which suppresses edge radiation, lowers EMI, and tightens return paths for high-speed signals running through dense multilayer stackups. The plated edge also strengthens the board mechanically and protects against moisture ingress at the cut line. Compared with conventional copper-clad boards, the wrapped solder joints are denser and less prone to lifting, giving better signal-to-noise ratio and better long-term reliability under vibration and thermal cycling. Typical uses are RF front-ends, 5G base-station modules, communication backplanes, instrumentation, and any high-frequency board where leakage at the edge is a known failure mode.