Communication Tower Printed Circuit Board
PRODUCT SPEC

Communication Tower Printed Circuit Board

A 6-layer hybrid stackup combining Rogers RO4350B for the RF layers with IT-180A FR-4 for the digital and power layers, finished with ENIG for solder joint reliability. The hybrid construction puts low-Dk material only where the RF signal lives and saves cost on the rest of the board. Designed for outdoor base-station and tower-top equipment, the board needs to survive mountaintop and rooftop installations: lightning surge, salt fog, UV, wide humidity swing, and sustained vibration. RO4350B keeps insertion loss flat through the cellular and microwave bands, and the multilayer routing supports tight antenna-to-radio integration. Applications include 5G macro and small-cell base stations, satellite ground stations, microwave backhaul, broadcast tower equipment, and defense communication links.

Specs

Layers6
MaterialRO4350B+IT-180A
Surface FinishENIG

Applications

Telecom5GSatelliteDefenseIndustrial Control