
A 3-layer high-frequency board on Rogers RO4003C (Dk 3.38, Df 0.0027 at 10GHz), 1.93±0.193mm thick with immersion gold finish. The asymmetric three-layer stack uses a top signal layer for routing, a center ground plane for current return and shielding, and a bottom layer for power, control, and inter-board interconnect. RO4003C gives stable Dk across temperature and frequency with minimal phase drift, suitable for industrial radios, sensor front-ends, and high-speed data links inside factory and process-control equipment. Immersion gold protects fine-pitch pads against oxidation under shop-floor humidity and temperature swings. Targets industrial control systems, smart-factory wireless gateways, telecom site equipment, instrumentation, and automotive infotainment subsystems where reliability outweighs cost.
Specs
| Layers | 3 |
| Material | RO4003C |
| Characteristic | High frequency and high speed |
| Board Thickness | 1.93±0.193mm |
| Surface Finish | Immersion Gold |
| Dielectric Constant (Dk) | 3.38 |
| Loss Tangent (Df) | 0.0027 |
Applications