
A 6-layer mixed-material high-frequency PCB combining Aerowave 300 RF laminate, S1000-2M FR-4, and R5575G high-speed core in one stackup, 2.1±0.21mm thick, with red solder mask. The hybrid build puts low-loss RF material on the antenna and signal layers and uses the cheaper FR-4 grade on power and digital layers, which keeps cost manageable while preserving microwave performance. The red solder mask is functional rather than cosmetic — it offers the same protection and impedance behavior as green LPI but lets system integrators distinguish RF subsystems on assembly lines. Aerowave 300 holds Dk well into mmWave bands. Used in telecom infrastructure, 5G modules, military and aerospace radios, automotive radar, and high-end industrial RF gear.
Specs
| Layers | 6 |
| Material | Aerowave 300 + S1000-2M + R5575G |
| Board Thickness | 2.1±0.21mm |
| Solder Mask | Red |
| Characteristic | High frequency and high speed, mixed material |
Applications