High Frequency Board with Resin Plugged Vias

A 3-stage HDI high-frequency board with resin-plugged vias, combining Tanoic RF-35TC RF laminate with Isola FR408HR high-speed FR-4. Resin plug-hole is the canonical fix when via-in-pad is required for fine-pitch BGA components: the via barrel is filled with epoxy resin, planarized, and capped with copper, which prevents solder wicking during reflow and gives a flat surface for component placement. Combined with 3-stage HDI (sequential lamination with stacked microvias), the board reaches the wiring density needed for high-pin-count chipsets while preserving high-frequency performance through the RF-35TC layers. Low-Dk RF-35TC also handles humid environments well due to low water absorption. Used in 5G mmWave radios, automotive radar with high-density processors, medical imaging front-ends, and industrial high-speed equipment.