High Frequency Board for 5G Products

A 2-layer high-frequency board combining Rogers FR-4 with RT/duroid PTFE laminate, 0.45mm thick, targeted at 5G antennas, front-ends, and small-cell radios above 1GHz. PCBs for 5G are characterized by high layer count, high aspect ratio, high density, and high transmission rate; for high-frequency boards specifically, material selection drives performance more than process. Dielectric properties (Dk, Df), heat resistance, mechanical strength, and cost all enter the trade-off. RT/duroid is used where Dk and loss tangent must hold through mmWave bands. The board substrate offers good heat resistance, chemical resistance, peel strength, and impact strength. Used in 5G base-station radios, 5G CPE and mobile devices, 5G IoT modules, satellite-IoT terminals, and connected-car telematics.