Edge Metallization Board

An edge-metallized PCB with the substrate edges plated in gold via immersion gold or electroplated gold. Edge metallization is a targeted EMC fix for multilayer boards: at high signal speeds, unintended currents reach the edges of the ground and power planes, and edge radiation becomes a dominant EMI source that can prevent the system from passing FCC, CE, or military EMC certification. By tying the edge to ground through a continuous plated copper-and-gold band, the board cuts edge radiation, suppresses cross-coupling between layers, and tightens power-supply integrity. Used in high-speed digital systems, RF modules that must pass strict EMC, military communication boards, aerospace electronics, and industrial control systems where the customer cannot afford a recall after a failed EMC test.