
A 6-layer heavy copper PCB for variable frequency drives (VFDs), built on S1150G high-Tg laminate at 2.9±0.29mm thick. The thick copper inner planes carry the large pulsed currents driving 3-phase motor windings, while the multilayer stack separates power, control, and gate-drive domains to keep switching noise away from the modulation logic. S1150G's high glass transition temperature gives stable dielectric properties under continuous heat from IGBT or SiC bridges, and supports reliable plated-through holes after multiple reflow cycles. The board is sized to host bulk DC-link capacitors, current-sense shunts, and isolated gate drivers in a single mechanical assembly. Typical use in industrial motor control, HVAC compressors, EV powertrain inverters, pumps, and renewable energy converters where low EMI and long-term thermal endurance are mandatory.
Specs
| Layers | 6 |
| Material | S1150G |
| Board Thickness | 2.9±0.29mm |
Applications