Amplifier PCB

A 6-layer heavy copper PCB for power amplifier modules, 2.16±0.216mm thick. The 6-layer stack separates audio or RF signal layers from power and ground planes, which keeps PSRR high and lowers crosstalk between input stages and output drivers. Heavy copper power planes carry the large standing currents demanded by Class A/AB output stages or RF PA modules, and act as a thermal spreader that pulls heat away from output transistors and bias circuits. The board geometry supports both through-hole audio components and SMT control logic, which is the common topology for high-fidelity and instrumentation amplifiers. Typical use in studio and live audio amplifiers, industrial signal conditioners, RF amplifier driver boards, broadcast equipment, and laboratory instrumentation where signal integrity and current capacity are equally important.