5G Communication PCB

A 12-layer heavy copper PCB designed for 5G base-station power and backplane modules, 3.05±0.305mm thick with thick copper inner layers. The stacked copper planes deliver the high DC currents required by Massive MIMO power amplifiers, beamforming front-ends, and active antenna units, while still leaving controlled-impedance routing layers for digital and intermediate-frequency signals. The thick power planes also act as a heat spreader, conducting waste heat from PA stages and DC-DC converters to the chassis, which raises long-term reliability under continuous transmit duty. The 12-layer count provides separation between RF, mixed-signal, and bulk power domains, reducing crosstalk in dense radio cards. Typical use in 5G macro and small-cell base stations, RRU/AAU radio units, fronthaul backplanes, telecom power shelves, and edge compute racks where current density and signal isolation must coexist.