
A heavy copper PCB platform for high-current, high-thermal-load, and high-reliability applications. The capability covers 2-38 layers, HDI or rigid-flex heavy-copper structures, finished thickness from 1.0-6.3 mm, UL-listed inner copper up to 12 oz and outer copper up to 15 oz. Line width, spacing, and annular ring are designed around copper thickness, with support for 0.10 mm laser vias, 0.15 mm mechanical drilling, 16:1 through-hole aspect ratio, and ENIG, ENEPIG, Flash Gold, Hard Gold, or OSP finishes.
Specs
| Structure | HDI structure; rigid-flex heavy copper board |
| Layers | 2-38 |
| Copper Weight | UL-listed inner 12 oz, outer 15 oz |
| Board Thickness | Finished 1.0-6.3 mm |
| Line / Space | Determined by copper thickness |
| Min Hole Size | 0.10 mm laser / 0.15 mm mechanical |
| Min Annular Ring | Determined by copper thickness |
| Aspect Ratio | 1:1 blind vias; 16:1 through holes |
| Dimensional Tolerance | +/-0.10 mm, special +/-0.05 mm |
| Surface Finish | ENIG, ENEPIG, Flash Gold, Hard Gold, OSP |
Applications