18-Layer Heavy Copper Board

An 18-layer heavy copper PCB at 5.3mm total thickness, built for high-density power and signal integration in industrial and telecom systems. The 18-layer stack divides power, ground, signal, and high-current planes across multiple zones, which lets a single board carry both the bulk DC current and the controlled-impedance signal routing that a complex backplane or power shelf needs. Heavy copper inner layers handle bus currents while thinner outer layers carry digital and supervisory signals. Manufacturing the stack requires strict press control, sequential lamination, and tight registration to keep impedance and via aspect ratio inside spec across 5.3mm of dielectric. Typical use in telecom power shelves, large UPS systems, server PSU motherboards, industrial drives, traction inverters, and high-power energy storage controllers where layer count, current, and thermal capacity must all scale together.