
A 12-layer heavy copper PCB at 5.2mm thickness, designed as a power and control fusion board for industrial converters and high-power telecom systems. The 12-layer stack provides multiple thick copper planes for DC bus distribution, dedicated ground returns, and isolated signal layers for gate drive and supervisory logic. Inner heavy copper layers carry tens to hundreds of amps continuously, while the outer layers provide fine-pitch SMT routing for digital control and protection. The 5.2mm overall thickness allows large via aspect ratios that handle high-current vias and via-in-pad strategies for compact power modules. Typical applications include high-power DC-DC stages, EV onboard chargers, traction inverters, telecom power shelves, photovoltaic and wind converters, and any backplane that needs to fuse heavy current distribution with low-EMI digital control on a single board.
Specs
| Layers | 12 |
| Board Thickness | 5.2mm |
Applications