Six engineering references. Interactive tools stay on this page, PDFs open in a new tab.
Complete design-for-manufacturability rules in printable format.
Microstrip + stripline Z₀ with ±5% FQC tolerance bands.
Filter 10 laminate options by Er, loss, Tg, and use case.
Build 2–32L stackups with live thickness + copper totals.
Single-page spec summary for quoting and DFM review.
20 PCB terms — HDI, ENIG, Megtron, VIPPO, and more.
Classic microstrip and stripline characteristic impedance. IPC-2141 simplified formulae. Production tolerance ±5%.
FQC production tolerance: ±5% (vs industry ±10%). Your board would run 56.9 – 62.8 Ω.
Rough estimate using IPC-2141 simplified formulae. Field solver required for production designs. FQC engineering team provides validated impedance stackup on request.
Ten laminate options FQC keeps qualified. Click any row for extended electrical, thermal, and moisture data.
| Material | Type | Er @ 1GHz | tan δ | Tg (°C) | Key Use Cases | Lead Time Impact |
|---|---|---|---|---|---|---|
ITEQ IT-180A▸ | FR-4 mid-Tg | 4.20 | 0.0200 | 180 | Standard multilayer | Stocked |
Isola FR408HR▸ | High-speed FR-4 | 3.70 | 0.0090 | 180 | Signal integrity, 10+ Gbps | Stocked |
Panasonic Megtron 6 (R-5775)▸ | Low-loss | 3.70 | 0.0040 | 185 | 28 Gbps SerDes, server backplane | +1 week |
Panasonic Megtron 7 (R-5785)▸ | Ultra-low-loss | 3.50 | 0.0030 | 200 | 56 Gbps / 112 Gbps PAM4 | +2 weeks |
Panasonic Megtron 8▸ | Next-gen LL | 3.30 | 0.0020 | 200 | 224 Gbps AI-server backplane | +3 weeks |
Rogers RO4350B▸ | Hydrocarbon ceramic | 3.66 | 0.0037 | 280 | RF / microwave < 40 GHz | +2 weeks |
Rogers RO3003▸ | PTFE | 3.00 | 0.0013 | 280 | Automotive radar 77 GHz | +3 weeks |
Taconic RF-35▸ | PTFE / ceramic | 3.50 | 0.0018 | 280 | mmWave, 5G | +3 weeks |
TUC TU-863▸ | Low-loss FR-4 | 3.90 | 0.0085 | 180 | Server backplane | Stocked |
Polyimide (DuPont Kapton)▸ | Flex | 3.40 | 0.0026 | 400 | Rigid-flex, aerospace | +2 weeks |
Build a representative multilayer construction. Choose layer count, outer copper weight, target thickness, and dielectric material.
Representative stackup. FQC engineering team finalizes with actual material datasheets and manufacturing constraints.
Thirty-two rules across eight categories. Follow these to reduce re-spins and hit first-pass yield.
Twenty terms you'll see in PCB datasheets, quote discussions, and DFM feedback.
Request a quote or schedule a DFM review with the FQC engineering team.
All calculations trace to IPC-2141 / IPC-2152 / IPC-A-600.