With the development of electronic technology, the degree of integration of electronic products is becoming higher and higher, the structure is becoming more and more delicate, and the manufacturing process is becoming more and more complex. This can lead to potential defects in the manufacturing process. For a good quality electronic product, it requires high performance indicators and high stability. The stability of electronic products is influenced by factors such as reasonable design, component performance, and overall manufacturing process. At present, high-temperature aging technology is widely used domestically and internationally to improve the stability and reliability of electronic products. High temperature aging can expose hidden dangers in production processes such as component defects, welding, and assembly in advance, ensuring that factory products can withstand the test of time. During the production of electronic products, there are two types of product quality problems caused by unreasonable design, raw materials, or process measures. The first type is that the product performance parameters do not meet the standards, and the product does not meet the usage requirements. The second type is potential defects, which cannot be detected by ordinary testing methods and need to be gradually exposed during use. Generally, this defect requires the component to operate at rated power and normal operating temperature for about a thousand hours before it can be fully activated. Obviously, testing each component for a thousand hours is unrealistic, and it requires applying heating stress and bias voltage, such as conducting high-temperature power stress experiments, to accelerate the early exposure of such defects. That is to apply heating, electrical, mechanical, or various comprehensive external stresses to electronic products, simulate harsh working environments, eliminate processing stress and residual solvents, and make latent faults appear in advance. The PCB aging we commonly refer to is when the PCB is powered on for a certain time under certain conditions, and some component parameters on the PCB will change. This change is related to the time the PCB is used, which is not allowed for some special purpose PCB. Therefore, many PCB will undergo anti-aging treatment before they grow, so that they can be used after the circuit is stabilized, which can greatly improve the reliability and safety. !laboratory of Sihui Fuji In the aging test of PCB, they are usually placed in a high temperature and humidity environment for long-term stable operation to simulate the use of products in extreme environments. By continuously monitoring and analyzing the performance indicators of the PCB, such as resistance, capacitance, inductance, etc., observe the failure of the PCB. In general industrial equipment, the working temperature generally undergoes alternating changes between -40 ℃ and+55 ℃, and may be in working condition for a long time. Therefore, it is necessary to test its performance and aging rate under long-term operation to consider the overall quality of the PCB. The aging test of PCB has many benefits. Firstly, it can help us verify the reliability of PCB, thereby determining the product's service life and maintenance cycle. It can provide production and design teams with important information about product performance and design, thereby improving product design and manufacturing to make it more suitable for users' use and needs. The aging test of PCB not only requires professional knowledge and skills, but also strict test standards and operating procedures. These standards and processes can ensure the accuracy and reliability of testing, thereby enhancing the credibility and practicality of PCB testing.
