Wireless Sensor PCB

A 6-layer R-5775G PCB at 0.5±0.1mm finished thickness, with any-layer laser-drilled microvias and a 0.04mm minimum line width and spacing. R-5775G is a low-loss high-speed laminate that keeps insertion loss flat for the radio front end and the high-speed digital interfaces wireless sensors increasingly carry. Any-layer HDI lets the designer route a fine-pitch BGA radio SoC with full freedom on every layer, which is critical for compact battery-powered sensor nodes where antenna geometry, power management, and digital control share a small board. The thin construction also keeps the assembled module low-profile for embedded deployments. Typical applications include IoT gateway and edge-sensor nodes, industrial wireless monitoring, smart-home sensors, instrumentation telemetry modules, and wearable connected devices.