
A 4-layer PCB built on NP-140TL mid-Tg laminate at 1.6±0.16mm thickness, manufactured with depth-controlled routing to create partial-depth slots, edge cutouts, and cavity features without breaking through the full board. The technique allows component embedding, mechanical clearance for connectors, and stepped board profiles within a single rigid panel, eliminating the need for multi-board assemblies in space-constrained enclosures. Tight Z-axis tolerance is held by spindle depth feedback and reference-fiducial alignment during the routing pass. Typical use cases include thin-profile consumer devices, automotive infotainment modules, industrial sensor packs, and IoT gateways where the housing requires recessed component zones. The NP-140TL substrate provides reliable performance under standard lead-free reflow while keeping cost competitive for medium-volume production.
Specs
| Layers | 4 |
| Material | NP-140TL |
| Board Thickness | 1.6±0.16mm |
Applications